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Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)
The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI).
This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.
This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.
Agency: Department of Defense
Office: DARPA - Microsystems Technology Office
Estimated Funding: $100,000
Office: DARPA - Microsystems Technology Office
Estimated Funding: $100,000
Who's Eligible
Obtain Full Opportunity Text:
SAM.gov Contract Opportunities
Additional Information of Eligibility:
All responsible sources capable of satisfying the Government's needs may submit a proposal that shall be considered by DARPA.
See the Eligibility Information section of the BAA for more information.
Full Opportunity Web Address:
https://sam.gov/opp/bb25df0332e14c62a528aeb496cb19ac/view
Contact:
Agency Email Description:
namiller@blm.gov
Agency Email:
Date Posted:
2023-01-23
Application Due Date:
Archive Date:
2023-05-11
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