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Fracture Putty
DARPA seeks to develop a dynamic putty which, when packed in/around a compound bone fracture, provides full load-bearing capabilities within hours, creates an osteoconductive bone-like internal structure, and degrades over time to harmless resorbable by-products as normal bone regenerates.
"See Attached Broad Agency Announcement (BAA)"
"See Attached Broad Agency Announcement (BAA)"
Agency: Department of Defense
Office: Defense Advanced Research Projects Agency
Estimated Funding: Not Available
Office: Defense Advanced Research Projects Agency
Estimated Funding: Not Available
Obtain Full Opportunity Text:
Not Available
Additional Information of Eligibility:
Not Available
Full Opportunity Web Address:
DARPA-BAA-08-50
Contact:
Mitchell Zakin
Agency Email Description:
BAA COORDINATOR
Agency Email:
BAA08-50@DARPA.MIL
Date Posted:
2008-08-13
Application Due Date:
2009-06-04
Archive Date:
2009-07-04
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