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Mapping the Entrepreneurial Landscape for Tibetans-in-Exile in India
The Public Diplomacy (PD) Section of the U. S. Embassy in New Delhi invites applications for a small grant to a Tibetan Scholarship Program (TSP) alumnus-associated active and FCRA-registered non-profit organization in India to design, coordinate, administer, and analyze an “ease-of-market-entry”
study to assess current barriers to entrepreneurship and geographical variation across the states of India faced by Tibetans-in-exile.With this cooperative award, the U. S. government seeks to build on the opportunities Tibetans face and identify challenges, and strengthen the economic and cultural resilience of the Tibetan community in exile in India.A proposal may address multiple entrepreneurial issues including but not limited to the ease of starting a business in India, applying licenses, and securing approval, basics of conducting market research, building a business, putting together a team, and seeking investment, partnership, and collaboration, etc.
This survey instrument may be modeled on other “ease of doing business” indices in current use.
(Please refer to the full announcement available under 'related documents' tab)
This survey instrument may be modeled on other “ease of doing business” indices in current use.
(Please refer to the full announcement available under 'related documents' tab)
Relevant Nonprofit Program Categories
Obtain Full Opportunity Text:
https://grants.nih.gov/grants/guide/rfa-files/RFA-OD-23-019.html
Additional Information of Eligibility:
• Tibetan-issues focused not-for-profit organizations, including think tanks and civil society/non-governmental organizations with one or more Tibetan Scholarship Program alum(s) associated in significant role.
• Public and private educational institutions • Public International Organizations and Governmental institutions
Full Opportunity Web Address:
http://grants.nih.gov/grants/guide/rfa-files/RFA-OD-23-019.html
Contact:
Agency Email Description:
ND_GrantApplications@state.gov
Agency Email:
Date Posted:
2023-06-22
Application Due Date:
Archive Date:
2023-09-20
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