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CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U. S. economic and national security.
This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million.
For more information, additional resources, and instructions on how to apply, please visit chips.gov.
Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov.
If you have any questions on how to apply, please email apply@chips.gov.
This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million.
For more information, additional resources, and instructions on how to apply, please visit chips.gov.
Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov.
If you have any questions on how to apply, please email apply@chips.gov.
Agency: Department of Commerce
Office: National Institute of Standards and Technology
Estimated Funding: $5,665,125
Office: National Institute of Standards and Technology
Estimated Funding: $5,665,125
Obtain Full Opportunity Text:
CHIPS Application Portal
Additional Information of Eligibility:
An applicant must be a “covered entity” to receive CHIPS Incentives.
For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Full Opportunity Web Address:
https://applications.chips.gov/s/
Contact:
Agency Email Description:
Agency Contact
Agency Email:
Date Posted:
2023-09-29
Application Due Date:
Archive Date:
2024-03-02
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