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U.S.-ASEAN Science, Technology and Innovation Cooperation (STIC) Program
The Bureau of East Asian and Pacific Affairs (EAP) Office of Multilateral Affairs (EAP/MLA) at the U. S. Department of State (DOS), announces this Notice of Funding Opportunity (“NOFO”) for the U. S. ASEAN Science, Technology and Innovation Cooperation (STIC) program.
A cooperative agreement for up to $3,456,250 U. S. Dollars (USD) in FY 2021 Economic Support Funds (ESF) will be awarded (pending availability of funds) for work that will foster Science, Technology and Innovation Cooperation in the ASEAN region.
The period of performance is 36 months.
Funding authority rests in the Foreign Assistance Act of 1961, as amended.
A cooperative agreement for up to $3,456,250 U. S. Dollars (USD) in FY 2021 Economic Support Funds (ESF) will be awarded (pending availability of funds) for work that will foster Science, Technology and Innovation Cooperation in the ASEAN region.
The period of performance is 36 months.
Funding authority rests in the Foreign Assistance Act of 1961, as amended.
Agency: Department of State
Office: Bureau of East Asian and Pacific Affairs
Estimated Funding: $1,000,000
Office: Bureau of East Asian and Pacific Affairs
Estimated Funding: $1,000,000
Relevant Nonprofit Program Categories
Obtain Full Opportunity Text:
Link to Opportunity in SAMS Domestic
Additional Information of Eligibility:
EAP welcomes applications from U. S. Non-profit/non-governmental organizations (NGOs) having a 501(c)(3) status with the IRS, or overseas-based non-profit/non-governmental organizations, and U. S. and overseas private/state institutions of higher education.
For-profit and commercial firms are not eligible to apply in response to this NOFO.
Full Opportunity Web Address:
https://mygrants.servicenowservices.com/grants?id=grants_funding_opportunity&table=u_domestic_funding_opportunity&sys_id=197ed8051b4c111048dbed3ce54bcbfd&view=Default
Contact:
Agency Email Description:
Direct questions about this funding announcement to:
Agency Email:
Date Posted:
2022-06-10
Application Due Date:
Archive Date:
2011-07-03
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